APAC Probe Card Market - Industry Trends And Forecast To 2029
- Published Date: 2022-12-31
- Report ID: 143928
- Pages: 225
-
Format:
Short Description
Asia-Pacific Probe Card Market, By Probe Type (Advanced Probe Card, and Standard Probe Card), Manufacturing Technology Type (MEMS, Vertical, Cantilever, Epoxy, Blade, Others), Wafer Size (More Than 12 Inches, and Less Than 12 Inches), Head Size (More Than 40mm x 40mm, and Less Than 40mm x 40mm), Test (DC Test, Functional Test, and AC Test), Material (Tungsten, Copper Clad Laminated (CCL), Aluminum, Others), Application (WLCSP, SIP, Mixed Signal Flip Chip, Analog), Beam Size (More Than 1.5 Mil, Less Than 1.5 Mil), End-Use (Foundry, Parametric, Logic and Memory Device, DRAM, CMOS Image Sensor (CIS), Flash, Others), Country (China, South Korea, Japan, India, Australia, Singapore, Malaysia, Indonesia, Thailand, Philippines and Rest of Asia-Pacific) Industry Trends and Forecast to 2029
Market Definition:
A probe card is an interface is used to perform a wafer test for a semiconductor wafer. This process is used to check the quality of integrated circuits or latent semantic indexing in the first process of semiconductor manufacturing. Generally, the probe card is electrically connected to a tester and mechanically docked to a prober. The main function of a probe card is to provide an electrical path between the test system and the circuits on the wafer, where the circuits can be tested. The main parts included in probe cards are called printed circuit boards (PCB) and some forms of contact elements. Many items are considered in a probe card, some being very common to use, and some having very special uses.
Market Segmentation:
The Asia-Pacific probe card market is segmented into nine notable segments based on probe type, manufacturing technology type, wafer size, head size, test, material, application, beam size, and end use.
On the basis of probe type, the Asia-Pacific probe card market is segmented into advanced probe card, and standard probe card
On the basis of manufacturing technology type, the Asia-Pacific probe card market is segmented into MEMS, vertical, cantilever, epoxy, blade, others
On the basis of wafer size, the Asia-Pacific probe card market is segmented into more than 12 inches, and less than 12 inches
On the basis of head size, the Asia-Pacific probe card market is segmented into more than 40mm x 40mm, and less than 40mm x 40mm
On the basis of test, the Asia-Pacific probe card market is segmented into DC Test, functional test, and AC test
On the basis of material, the Asia-Pacific probe card market is segmented tungsten, Copper Clad Laminated (CCL), aluminum, others
On the basis of application, the Asia-Pacific probe card market is segmented into WLCSP, SIP, mixed signal flip chip, and analog
On the basis of beam size, the Asia-Pacific probe card market is segmented into more than 1.5 mil, less than 1.5 mil
On the basis of end-use, the Asia-Pacific probe card market is segmented into foundry, parametric, logic and memory device, DRAM, CMOS image sensor (CIS), flash, others
Market Players
Some of the key market players in the Asia-Pacific probe card market are listed below:
FormFactor
Chunghwa Precision Test Tech.Co., Ltd.
FEINMETALL GmbH
RIKA DENSHI CO., LTD.
TSE co,. Ltd.
dynamic-test
STAr Technologies Inc.
MICRONICS JAPAN CO., LTD.
Microfriend
Korea Instrument Co.,Ltd.
MPI CORPORATION
Onto Innovation
Japan ELECTRONIC MATERIALS CORPORATION
WinWay Tech. Co., Ltd.
Technoprobe S.p.A.
WILLTECHNOLOGY
Wentworth Labs
htt high tech trade GmbH
SV Probe
TABLE OF CONTENTS
1 INTRODUCTION 37
1.1 OBJECTIVES OF THE STUDY 37
1.2 MARKET DEFINITION 37
1.3 OVERVIEW OF ASIA PACIFIC PROBE CARD MARKET 37
1.4 CURRENCY AND PRICING 39
1.5 LIMITATIONS 39
1.6 MARKETS COVERED 40
2 MARKET SEGMENTATION 43
2.1 MARKETS COVERED 43
2.2 GEOGRAPHICAL SCOPE 44
2.3 YEARS CONSIDERED FOR THE STUDY 45
2.4 DBMR TRIPOD DATA VALIDATION MODEL 46
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 49
2.6 DBMR MARKET POSITION GRID 50
2.7 VENDOR SHARE ANALYSIS 51
2.8 MULTIVARIATE MODELING 52
2.9 PROBE TYPE TIMELINE CURVE 52
2.10 MARKET APPLICATION COVERAGE GRID 53
2.11 THE MARKET CHALLENGE MATRIX 54
2.12 SECONDARY SOURCES 55
2.13 ASSUMPTIONS 55
3 EXECUTIVE SUMMARY 56
4 PREMIUM INSIGHTS 59
4.1 SUPPLY CHAIN 61
4.1.1 MANUFACTURERS 61
4.1.2 CONSUMPTION 61
5 MARKET OVERVIEW 62
5.1 DRIVERS 64
5.1.1 INCREASING USE OF INTEGRATED CIRCUITS IN ELECTRONIC DEVICES 64
5.1.2 SURGE IN DEMAND FOR ELECTRONIC TESTING IN THE SEMICONDUCTOR INDUSTRY 64
5.1.3 GROWING INVESTMENT IN MINIATURIZATION OF ELECTRONIC COMPONENT 65
5.1.4 RISING DEMAND FOR SEMICONDUCTORS PROBE CARDS IN AUTOMOBILE INDUSTRY 65
5.2 RESTRAINTS 66
5.2.1 HIGH COST ASSOCIATED WITH PROBE CARD SOLUTION 66
5.2.2 IMPACT OF METAL PRICES ON OVERALL COMPONENT PRODUCTION COST 66
5.3 OPPORTUNITIES 67
5.3.1 RISE IN STRATEGIC PARTNERSHIP AND COLLABORATION 67
5.3.2 RISING ADOPTION OF PROBE CARDS SOLUTION IN AUTOMOTIVE INDUSTRY 67
5.3.3 INCREASING USE OF SEMICONDUCTORS IN MILITARY AND DEFENSE SECTOR 67
5.4 CHALLENGES 68
5.4.1 LACK OF AWARENESS AMONG CONSUMERS REGARDING BENEFITS OF PROBE CARD SOLUTION 68
5.4.2 DISRUPTION IN SUPPLY OF PROBE CARD 68
5.4.3 TECHNOLOGICAL ACCELERATION CREATES A CHALLENGING ENVIRONMENT FOR PROBE CARD SOLUTION 69
6 IMPACT ANALYSIS OF COVID-19 ON ASIA PACIFIC PROBE CARD MARKET 70
6.1 ANALYSIS ON IMPACT OF COVID-19 ON THE MARKET 70
6.2 STRATEGIC DECISIONS BY MANUFACTURERS AFTER COVID-19 70
6.3 IMPACT ON PRICE 70
6.4 IMPACT ON DEMAND AND SUPPLY CHAIN 71
6.5 CONCLUSION 71
7 ASIA PACIFIC PROBE CARD MARKET, BY PROBE TYPE 72
7.1 OVERVIEW 73
7.2 ADVANCED PROBE CARD 74
7.2.1 MEMS SP 75
7.2.2 VERTICAL PROBE 75
7.2.3 U-PROBE 75
7.2.4 SP-PROBE 75
7.2.5 OTHERS 75
7.3 STANDARD PROBE CARD 75
8 ASIA PACIFIC PROBE CARD MARKET, BY MANUFACTURING TECHNOLOGY TYPE 76
8.1 OVERVIEW 77
8.2 MEMS 78
8.3 VERTICAL 78
8.4 CANTILEVER 79
8.5 EPOXY 80
8.6 BLADE 80
8.7 OTHERS 81
9 ASIA PACIFIC PROBE CARD MARKET, BY WAFER SIZE 82
9.1 OVERVIEW 83
9.2 MORE THAN 12 INCHES 84
9.3 LESS THAN 12 INCHES 84
10 ASIA PACIFIC PROBE CARD MARKET, BY HEAD SIZE 86
10.1 OVERVIEW 87
10.2 MORE THAN 40MM X 40MM 88
10.3 LESS THAN 40MM X 40MM 88
11 ASIA PACIFIC PROBE CARD MARKET, BY TEST 90
11.1 OVERVIEW 91
11.2 DC TEST 92
11.3 FUNCTIONAL TEST 92
11.4 AC TEST 93
12 ASIA PACIFIC PROBE CARD MARKET, BY MATERIAL 94
12.1 OVERVIEW 95
12.2 TUNGSTEN 96
12.3 COPPER CLAD LAMINATED (CCL) 96
12.4 ALUMINUM 97
12.5 OTHERS 97
13 ASIA PACIFIC PROBE CARD MARKET, BY APPLICATION 99
13.1 OVERVIEW 100
13.2 WLCSP 101
13.3 SIP 101
13.4 MIXED SIGNAL FLIP CHIP 102
13.5 ANALOG 103
14 ASIA PACIFIC PROBE CARD MARKET, BY BEAM SIZE 104
14.1 OVERVIEW 105
14.2 MORE THAN 1.5 MIL 106
14.3 LESS THAN 1.5 MIL 106
15 ASIA PACIFIC PROBE CARD MARKET, BY END-USE 108
15.1 OVERVIEW 109
15.2 FOUNDRY 110
15.2.1 ADVANCED PROBE CARD 111
15.2.2 STANDARD PROBE CARD 111
15.3 PARAMETRIC 111
15.3.1 ADVANCED PROBE CARD 112
15.3.2 STANDARD PROBE CARD 112
15.4 LOGIC AND MEMORY DEVICE 112
15.4.1 ADVANCED PROBE CARD 113
15.4.2 STANDARD PROBE CARD 113
15.5 DRAM 113
15.5.1 ADVANCED PROBE CARD 114
15.5.2 STANDARD PROBE CARD 114
15.6 CMOS IMAGE SENSOR (CIS) 114
15.6.1 ADVANCED PROBE CARD 115
15.6.2 STANDARD PROBE CARD 115
15.7 FLASH 115
15.7.1 ADVANCED PROBE CARD 116
15.7.2 STANDARD PROBE CARD 116
15.8 OTHERS 116
16 ASIA PACIFIC PROBE CARD MARKET, BY REGION 117
16.1 ASIA-PACIFIC 118
16.1.1 CHINA 129
16.1.2 TAIWAN 133
16.1.3 SOUTH KOREA 137
16.1.4 JAPAN 141
16.1.5 INDIA 145
16.1.6 SINGAPORE 149
16.1.7 AUSTRALIA 153
16.1.8 THAILAND 157
16.1.9 MALAYSIA 161
16.1.10 PHILIPPINES 165
16.1.11 REST OF ASIA-PACIFIC 169
17 ASIA PACIFIC PROBE CARD MARKET: COMPANY LANDSCAPE 170
17.1 COMPANY SHARE ANALYSIS: ASIA PACIFIC 170
18 SWOT ANALYSIS 171
19 COMPANY PROFILE 172
19.1 FORMFACTOR 172
19.1.1 COMPANY SNAPSHOT 172
19.1.2 REVENUE ANALYSIS 172
19.1.3 COMPANY SHARE ANALYSIS 173
19.1.4 PRODUCT PORTFOLIO 173
19.1.5 RECENT DEVELOPMENTS 174
19.2 TECHNOPROBE S.P.A. 175
19.2.1 COMPANY SNAPSHOT 175
19.2.2 COMPANY SHARE ANALYSIS 175
19.2.3 PRODUCT PORTFOLIO 175
19.2.4 RECENT DEVELOPMENT 176
19.3 MICRONICS JAPAN CO., LTD. 177
19.3.1 COMPANY SNAPSHOT 177
19.3.2 REVENUE ANALYSIS 177
19.3.3 COMPANY SHARE ANALYSIS 178
19.3.4 PRODUCT PORTFOLIO 178
19.3.5 RECENT DEVELOPMENT 178
19.4 MPI CORPORATION 179
19.4.1 COMPANY SNAPSHOT 179
19.4.2 REVENUE ANALYSIS 179
19.4.3 COMPANY SHARE ANALYSIUS 180
19.4.4 PRODUCT PORTFOLIO 180
19.4.5 RECENT DEVELOPMENTS 180
19.5 CHUNGHWA PRECISION TEST TECH.CO. LTD 181
19.5.1 COMPANY SNAPSHOT 181
19.5.2 REVENUE ANALYSIS 181
19.5.3 COMPANY SHARE ANALYSIS 182
19.5.4 PRODUCT PORTFOLIO 182
19.5.5 RECENT DEVELOPMENT 182
19.6 FEINMETALL GMBH 183
19.6.1 COMPANY SNAPSHOT 183
19.6.2 PRODUCT PORTFOLIO 183
19.6.3 RECENT DEVELOPMENTS 184
19.7 HTT HIGH TECH TRADE GMBH 185
19.7.1 COMPANY SNAPSHOT 185
19.7.2 PRODUCT PORTFOLIO 185
19.7.3 RECENT DEVELOPMENTS 187
19.8 KOREA INSTRUMENT CO., LTD 188
19.8.1 COMPANY SNAPSHOT 188
19.8.2 PRODUCT PORTFOLIO 188
19.8.3 RECENT DEVELOPMENT 188
19.9 JAPAN ELECTRONIC MATERIALS CORPORATION 189
19.9.1 COMPANY SNAPSHOT 189
19.9.2 REVENUE ANALYSIS 189
19.9.3 PRODUCT PORTFOLIO 190
19.9.4 RECENT DEVELOPMENT 190
19.10 MICROFRIEND 191
19.10.1 COMPANY SNAPSHOT 191
19.10.2 PRODUCT PORTFOLIO 191
19.10.3 RECENT DEVELOPMENT 192
19.11 ONTO INNOVATION 193
19.11.1 COMPANY SNAPSHOT 193
19.11.2 REVENUE ANALYSIS 193
19.11.3 PRODUCT PORTFOLIO 194
19.11.4 RECENT DEVELOPMENTS 194
19.12 SV PROBE 195
19.12.1 COMPANY SNAPSHOT 195
19.12.2 PRODUCT PORTFOLIO 195
19.12.3 RECENT DEVELOPMENT 195
19.13 STAR TECHNOLOGIES INC. 196
19.13.1 COMPANY SNAPSHOT 196
19.13.2 PRODUCT PORTFOLIO 196
19.13.3 RECENT DEVELOPMENTS 197
19.14 RIKA DENSHI CO., LTD. 198
19.14.1 COMPANY SNAPSHOT 198
19.14.2 PRODUCT PORTFOLIO 198
19.14.3 RECENT DEVELOPMENT 198
19.15 TSE CO,. LTD. 199
19.15.1 COMPANY SNAPSHOT 199
19.15.2 REVENUE ANALYSIS 199
19.15.3 PRODUCT PORTFOLIO 200
19.15.4 RECENT DEVELOPMENT 200
19.16 TRANSLARITY 201
19.16.1 COMPANY SNAPSHOT 201
19.16.2 PRODUCT PORTFOLIO 201
19.16.3 RECENT DEVELOPMENT 201
19.17 DYNAMIC-TEST 202
19.17.1 COMPANY SNAPSHOT 202
19.17.2 PRODUCT PORTFOLIO 202
19.17.3 RECENT DEVELOPMENTS 202
19.18 WILL TECHNOLOGY 203
19.18.1 COMPANY SNAPSHOT 203
19.18.2 PRODUCT PORTFOLIO 203
19.18.3 RECENT DEVELOPMENTS 204
19.19 WENTWORTH LABS 205
19.19.1 COMPANY SNAPSHOT 205
19.19.2 PRODUCT PORTFOLIO 205
19.19.3 RECENT DEVELOPMENTS 206
19.20 WINWAY TECH. CO., LTD. 207
19.20.1 COMPANY SNAPSHOT 207
19.20.2 PRODUCT PORTFOLIO 207
19.20.3 RECENT DEVELOPMENT 207
20 QUESTIONNAIRE 208
21 RELATED REPORTS 213
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